| Towa Intercon Technology, Inc. |  | Towa Intercon Technology, Inc. company makes equipment used in the back end of semiconductor production. After front-end equipment deposits precise layers of materials onto silicon wafers and then etches circuit patterns into these layers, back-end gear gets chips ready for use by cutting apart the wafers and packaging the resulting chips into molded plastic housings. Towa Intercon makes specialized sawing systems that divide wafers into individual chips through a process called singulation. The company also markets chip package molding devices from Japan-based semiconductor equipment maker TOWA. Towa Intercon is a wholly owned subsidiary of TOWA. | | Visit Website | | Office Address | 18255 Sutter Blvd.,
Morgan Hill, CA, 95037 USA | | Phone | (408)-778-5992 | | Fax | (408) 778-0052 | | Send Enquiry
| | Executives | Marian Hernandez, Human Resources Supervisor |
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