| Semitool, Inc. |  | Semitool, Inc. (Semitool) designs, manufactures, installs and services engineered equipment for use in the fabrication of semiconductor devices. The Company’s products are focused on the wet chemical process steps in integrated circuit (IC) manufacturing and include systems for wafer surface preparation and electrochemical deposition (ECD) applications. The Company’s surface preparation systems are designed for Front End of Line (FEOL), Back End of Line (BEOL) and wafer level packaging of ICs processes. The Company’s single-wafer FEOL surface preparation systems are used for photoresist stripping, post etch and pre-diffusion cleans. The Company’s ECD systems are used to plate copper and other metals, which are used for the IC’s internal wiring, or interconnects; to plate solder and lead free solder bumps, and to plate other metals for a range of semiconductor and related applications. In December 2009, Applied Materials, Inc. acquired Semitool, Inc. | | Visit Website | | Office Address | 655 West Reserve Drive,
Kalispell, MT, 59901 USA | | Phone | (406) 752-2107 | | Fax | (406) 752-5522 | | Executives | Raymon F. (Ray) Thompson, Chairman and CEO | | Larry E. Murphy, President and COO |
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