| Amkor Technology, Inc. |  | Amkor Technology, Inc. operates as a subcontractor of semiconductor packaging and test services in the United States and internationally. It provides packaging solutions, including leadframe and laminate packages using wire bond and flip chip formats. The company offers flip chip and wafer level packages in which the semiconductor die is connected directly to the package substrate or system board; three dimensional (3D) package-on-package and stacked chip scale packages in which the individual chips or individual packages are stacked vertically to provide integration of logic and memory; advanced leadframe packages, which are thinner and smaller packages; multi-chip or system-in-package modules used in mobile phones and other handheld end-products; and packages for micro-electromechanical system devices that are used in automotive, industrial, and consumer electronics markets. It also provides a line of advanced probe and final test services for analog, digital, logic, mixed signal, and radio frequency semiconductor devices. The company was founded in 1968 and is headquartered in Chandler, Arizona. | | Visit Website | | Office Address | 1900 South Price Road,
Chandler, AZ, 85286 USA | | Phone | (480) 821-5000 | | Fax | (480) 821-8276 | | Send Enquiry
| | Executives | James Kim, Founder and Executive Chairman | | Kenneth T. Joyce, CEO and President | | Joanne Solomon, CFO and Corp. VP |
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